Flagship models across four lines · BGA rework & reballing, X-ray inspection (including 3D/CT), X-ray component counting, and AOI/SPI. Additional SKUs and configurations are available; all pricing is provided on request for North American delivery.
Optical- and visual-alignment automatic rework stations for precision reballing and reworking of BGA/CSP/QFN packages · camera-guided placement, closed-loop hot-air/IR reflow, plus inline desolder-clean-reball systems and automated reballing lines.

Optical-alignment BGA rework station with camera-guided vision placement for precise BGA/chip rework.

Fully automatic optical-alignment BGA rework system with high-accuracy vision alignment and multi-zone thermal profiling.

Ultra-large-format precision rework workstation for big boards and modules requiring wide-area, uniform heating.

Large multifunctional fully-automatic intelligent rework station for demanding, high-mix BGA rework.

Fully automatic inline desolder-clean-reball-solder machine for high-volume BGA reballing on a production line.

Integrated desoldering and tin-removal rework machine that unifies chip removal and residual-solder cleaning.

BGA desolder-and-reball automated rework line for high-volume, continuous reballing operations.
Industrial X-ray and CT systems for high-resolution inspection · volumetric 3D/CT, IC/PCBA and semiconductor packages, wound and cylindrical lithium-battery cells, and NDT of castings and weldments.

Industrial CT/3D X-ray inspection system delivering high-resolution volumetric imaging for internal defect analysis.

High-speed CT-type fully-automatic X-ray inspection system for inline volumetric quality control.

Offline X-ray inspection system for ICs and PCBA, revealing solder voids, bridging and hidden joint defects.

High-end offline X-ray inspection system for fine-pitch IC and semiconductor package analysis.

X-ray inspection system for wound (jelly-roll) battery cells, checking anode/cathode overhang and alignment.

X-ray inspection system for cylindrical battery cells with automated internal-structure defect detection.

Intelligent DR X-ray inspection system for NDT of castings and weldments, detecting porosity and cracks.
X-ray SMD component counters · offline, inline and high-speed · that automatically count reels, trays and cut-tape without unpacking, for fast and accurate SMD material inventory.

Offline automatic X-ray SMD component counter for fast, non-destructive reel and tray inventory counting.

Inline automatic X-ray component counter for integrated, high-throughput SMD material counting.
Automated optical and solder-paste inspection systems for the SMT line, verifying paste deposition and placement quality before defects reach reflow.
Additional models and configurations are available across every line (extended BGA, IC, battery, 3D/CT, casting and high-speed counter SKUs). Request a quote with your requirement and we’ll match the right system.