Four instrument families that together measure every variable driving solder quality — temperature, oven thermal performance, in-oven atmosphere, and conveyor mechanics. All pricing on request for North American delivery.

32-channel travelling thermal profiler with ESA Profiler analytics — curve tolerance, SPC, CPK and PPI in one pass.

Thermal performance evaluation for reflow ovens — uniformity, convection, chain-speed and CPK capability via ERES software.

Travels with the PCB to log oxygen, temperature and rail vibration inside the oven — defect analysis and nitrogen cost control.

Measures rail width, parallelism, deformation, level, incline and XYZ vibration in-production — no line stoppage required.